Wafer Dicing Saw and Post Wafer Cleaning

UnitedkingdomTenders notice for Wafer Dicing Saw and Post Wafer Cleaning. The reference ID of the tender is 92860694 and it is closing on 10 Jan 2024.

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Tender Details

  • Country: United Kingdom
  • Summary: Wafer Dicing Saw and Post Wafer Cleaning
  • GBT Ref No: 92860694
  • Deadline: 10 Jan 2024
  • Competition: ICB
  • Financier: Self Financed
  • Purchaser Ownership: Public
  • Tender Value: Refer Document
  • Notice Type: Tender
  • Document Ref. No.: NOV458814
  • Purchaser's Detail :
  • Purchaser : UNIVERSITY OF SOUTHAMPTON
    UNIVERSITY OF SOUTHAMPTON
    10007158
    BUILDING 37, HIGHFIELD CAMPUS,UNIVERSITY ROAD
    SOUTHAMPTON
    SO171BJ
    UK
    Contact person : Amy Hands
    Telephone : +44 2380595000
    E-mail : procurement@soton.ac.uk
    NUTS : UKJ32
    Internet address(es)
    Main address : http : //www.southampton.ac.uk
    Address of the buyer profile : https : //in-tendhost.co.uk/universityofsouthampton/aspx/Home

    Email :procurement@soton.ac.uk
    URL :http://www.southampton.ac.uk

  • Description :
  • The University of Southampton seeks to acquire a complete dicing system for the University's optical and semiconductor materials processing capabilities for a number of high-impact projects in the major engineering themes of Quantum Technologies, Photonics and Advanced Manufacturing.

    Title: Wafer Dicing Saw and Post Wafer Cleaning
    OCID: ocds-h6vhtk-041d04
    Published by: University of Southampton
    Authority ID: AA20936
    Publication Date: 28/11/2023
    Deadline Date: 10/01/2024
    Deadline Time: 12:00
    Notice Type: Contract Notice
    Has Documents: No
    Has SPD: No
    Abstract: The University of Southampton seeks to acquire a complete dicing system for the University's optical and semiconductor materials processing capabilities for a number of high-impact projects in the major engineering themes of Quantum Technologies, Photonics and Advanced Manufacturing. This system is a replacement for the current dicing saw for Building 53 back-end of line cleanroom facility and an upgrade to meet the demands of current projects and technologies. Dicing is a fundamental part of the cleanroom and underpins a significant number of ongoing and future grants. The acquisition of this system will enable university researchers to machine surfaces and micron sized ridge structures with nanoscale surface roughness and low amounts of topside chipping in optical and semiconductor materials. This dicing machine will allow the fabrication of new devices that w...
  • Documents :
  •  Tender Notice

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