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Tender Details
- Country: United Kingdom
- Summary: Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey Itt
- GBT Ref No: 119474622
- Deadline: 20 Jun 2025
- Competition: ICB
- Financier: Self Financed
- Purchaser Ownership: Public
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: UOS-35651-2025
- Purchaser's Detail :
- Description :
- The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line.
Main CPV code: 31712330 - Semiconductors - Documents :
Purchaser : UNIVERSITY OF STRATHCLYDE
University of Strathclyde Learning & Teaching Building, 49 Richmond Street Glasgow G1 1XU
Contact Person : Anna Sanina
Telephone : +44 7811592949
Email :anna.sanina@strath.ac.uk
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